07 Nov 2023
MAE postdoctoral fellow (2022 PhD in Mechanical Engineering) Dr. Yuanjie CHENG, supervised by Prof. Ricky LEE, presented a paper entitled "Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance" at ICEP2023 and his paper was selected to receive the Outstanding Technical Paper Award of 2023 International Conference on Electronics Packaging (ICEP2023). The awarding ceremony will be held in April next year as part of ICEP2024.
About the paper
Y. Cheng, J. C. C. Lo, X. Qiu, H. Xu, M. Tao, and S. W. R. Lee, "Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance," 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 2023, pp. 135-136, doi: 10.23919/ICEP58572.2023.10129754.
Quantum dot (QD) color conversion (QDCC) film with monochrome excitation backlight is a promising way to implement mini/micro-LED displays. However, it still faces the challenges of low color conversion efficiency and unsatisfied color gamut owing to insufficient QD concentration in QDpolymer solution. In this paper, we studied the influence of QD surface modification and solvent on the QD-polymer solution stability and QD concentration. The QD concentration was improved by modifying QDs with carboxyl-acid-modified polyethylene glycol (PEG-COOH) ligands and adding additional toluene into the solution. The color conversion efficiency and the color gamut of the QDCC film were improved accordingly.
International Conference on Electronics Packaging (ICEP) is the largest international conference on electronic packaging in Japan which is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering topics including advanced packaging, design, modeling and reliability, emerging technologies, etc.